The expert for E.M.I and
Thermal Management solutions.
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Chomerics invented and has extended virtually every aspect of
conductive elastomer materials technology. Chomerics' CHO-SEAL* and CHOSIL®
materials allow for cos^performance material choices to provide needed levels
of attentuation. These elastomer EMI gaskets are available in a tremendous
variety of moulded, die-cut, and extruded shapes and sizes. Chomerics offers
the broadest range of metal-based EMI gaskets available anywhere. These
include all-metal knitted mesh, mesh with elastomer core, hollow knitted
highly resilient gasket, wire mesh over foam gasket, combined EMI
shielding-weartier seal gaskets, and gasketing with embedded weather seal |
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Today's powerful systems require increased EMI shielding without
compromising airflow. Offered in a choice of configurations and performance
levels, Chomerics' STREAM SHIELD™ vents are cost-effectively manufactured for
a variety of applications. The WIr+SHIElD™ and EmiClare™ range of
performance-tested glass and plastic shielded windows are lor visual displays
requiring EMI radiation or susceptibility shielding. These windows have been
designed to provide highly effective electromagnetic shielding while
providing exceptional optical clarity and image resolution. |
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Cost effective CHOSORB" EMI ferrites reduce conducted emissions
on signal lines and power cables without affecting data transmission.
Chomerics' CHOSORB" ferrite attenuators are made of specially formulated
soft ferrite material. CHO-SORB* ferrites allow desired signals to pass
through cables or circuits while absorbing extraneous and unwanted energy. Also CHO-BOND Conductive Adhesives CHO-BOND Conductive Caulks and Sealants CHO-SHIELD Coatings |
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A family of economical speciality laminated materials for commercial
EMI shielding. These laminates ore available in bulk rolls for customising
into EMI shields, ground planes, ground straps, shadow shields, ESD shields
and a host of other electronic applications. Laminates provide an
environmentally friendly solution that eliminates solvents, conductive
paints, or plating processes. |
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The SOFTSHIEID® EAAI gasket family brings new flexibility to shielding
decision. The product range provides material choices, performance levels,
configurations, and attachment methods that suit virtually any requirement.
SPRING4JNE™ beryllium copper gaskets combine high levels of EMI shielding
effectiveness with spring-finger wiping and low closure force properties. The
high performance qualities of beryllium copper - high tensile strength,
excellent anti-corrosion properties, and superb electrical conductivity -
make it an ideal material for EMI shielding over a broad frequency range. |
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Cost effective CHOSORB" EMI ferrites reduce conducted emissions
on signal lines and power cables without affecting data transmission.
Chomerics' CHOSORB" ferrite attenuators are made of specially formulated
soft ferrite material. CHO-SORB* ferrites allow desired signals to pass
through cables or circuits while absorbing extraneous and unwanted energy. |
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The EMI Shielding Tapes Kit contains six 2.5 cm x 33 m rolls of
conductive foil and fabric tapes. It is designed to provide a wide range of
price, performance and options in an easy-to-use package. The Kit includes
copper, aluminium and tin-plated copper CHO-FOIL® shielding tapes. Also
included is CHO-FAB™ shielding tape, consisting of a corrosion resistant,
nickel-plated cloth with a highly conductive pressure-sensitive adhesive. |
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• Phase Change Thermal Interface Materials The THERMFLOW™ family of phase change
thermal interface materials combines the
consistency and ease of use of elastomeric pads with the low
thermal impedance of thermal grease. This winning combination
mates THERMFI.OW material an excellent choice
for today's most demanding thermal interface
applications. |
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• Thermally Conductive Adhesive Tapes The THERMATTACH family of thermally
conductive adhesive tapes is used extensively to
bond heat sinks to microprocessors and other power
dissipating semiconductors. These tapes combine
exceptional bonding strength with low thermal impedance to
effectively replace thermal grease
and mechanical fasteners. |
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• Thermally Conductive Insulators CHO-THERM* thermal interface pads
conform to uneven surfaces to lower the contact resistance
between hot components and heat sinks. These
materials feature silicone resins filled with boron nitride,
magnesium oxide or aluminum oxide particles to achieve a
range of thermal conductivity. |
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• Thermally Conductive Gap Fillers The THERM-A-GAP™ family of
"super-soft" materials fills air gaps between hot components and heat
sinks or metal chassis. Their flexible, elastic nature
allows them to blanket highly uneven surfaces. Heat is
conducted away from separate components or entire PCBs into
metal covers, frames or spreader plates. |
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• Flexible Heat Spreader The T-WING* family of thin, flexible
heat spreaders provides a low-cost, effective means of
cooling 1C devices in restricted spaces where conventional
heat sinks aren't appropriate. The compliant nature of
these "thermal wing" heat spreaders permits nearly 100%
adhesive contact with non-flat package surfaces,
optimizing thermal and mechanical performance. |
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For more information please send as your request by fax or e-mail |
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