• Phase Change Thermal Interface Materials

The THERMFLOW™ family of phase change thermal

interface materials combines the consistency and ease of

use of elastomeric pads with the low thermal impedance of

thermal grease. This winning combination mates

THERMFI.OW material an excellent choice for today's

most demanding thermal interface applications.

• Thermally Conductive Adhesive Tapes

The THERMATTACH family of thermally conductive

adhesive tapes is used extensively to bond heat sinks

to microprocessors and other power dissipating

semiconductors. These tapes combine exceptional bonding

strength with low thermal impedance to effectively replace

thermal grease and mechanical fasteners.

• Thermally Conductive Insulators

CHO-THERM* thermal interface pads conform to uneven

surfaces to lower the contact resistance between hot

components and heat sinks. These materials feature silicone

resins filled with boron nitride, magnesium oxide or

aluminum oxide particles to achieve a range of thermal

conductivity.

• Thermally Conductive Gap Fillers

The THERM-A-GAP™ family of "super-soft" materials fills air

gaps between hot components and heat sinks or metal

chassis. Their flexible, elastic nature allows them to blanket

highly uneven surfaces. Heat is conducted away from

separate components or entire PCBs into metal covers,

frames or spreader plates.

• Flexible Heat Spreader

The T-WING* family of thin, flexible heat spreaders

provides a low-cost, effective means of cooling 1C devices

in restricted spaces where conventional heat sinks aren't

appropriate. The compliant nature of these "thermal wing"

heat spreaders permits nearly 100% adhesive contact

with non-flat package surfaces, optimizing thermal and

mechanical performance.