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Fuses, Switches, Breakers, Solid State Relays, Control Relays, Sensors, Plastic Enclosures, Cable Glands, Warning Beacons

      

57  Kallipoleos Athens 10444  Greece  Tell: 0030 210 5120034  Fax: 0030 210 5120064  Email hagelec@otenet.gr

 

 

 

 

 

 

 

Hagelec co.,  Components

 

   

 
Heat Sings

 

Microprocessors
Complete cooling solutions are available for popular microprocessors, including interface material and attachment methods.

Aavid Thermalloy Microprocessor Cooling Solutions

Max Clips™ The Max Clip System™ for power transistors is a high performance, low cost way to eliminate mounting holes, screws, rivets, and thermal inefficiency.

Standard Electrical Packages
 

Off-the-shelf cooling solutions for standard electrical packages.

Packages

TO3   TO5&39  TO66    TO202  TO218  T0220    TO247  TO262  BGA  DC TO DC  For LEDs   DIP 

BRIDGES&TO126  MULTIWATT-SIP SURFACE MOUNT

Extrusion Profiles
Use our selector to pinpoint the right extrusion from the many profiles available.
European Profiles
Search the most popular profiles manufactured and stocked in Europe.


Ball Grid Arrays (BGA)
A family of BGA heat sinks offers a wide range of cooling solutions for motherboard, video card, and networking applications.

BGA heat sinks

Bonded Fin Heat Sinks
Bonded Fin technologies cool high power applications with high fin densities unavailable in extrusions.

DC to DC Converters
Heat sinks designed to match popular DC to DC converter packages, extending their life and performance.

heat sinks for dc-dc convertersheat sinks for dc-dc convertersheat sinks for dc-dc converters
Polar Cap™ Coolers
Polar Cap Heat Sinks can be used to cool any type of electronics equipment from power transistors to thermoelectric modules.

Polar Cap

Electrolytic Capacitors
Cap Coolers improve the performance and extend the life of 3" diameter electrolytic capacitors.

Cap Coolers

Forced Convection Coolers
Custom designed solutions using quadrant extrusions to cool high power applications

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IGBT Modules
Choose from several options for cooling IGBT modules - cold plates, extrusions, bonded fin, and fan heat sinks.
                           Heat Sink Bonded Fin
Folded Fin Heat Sinks
Folded Fin technology adds surface area to cool high power applications in a lightweight package. Folded fin assemblies offer maximum forced air cooling in a minimum volume.

                                     Folded Fin
LED Light Sources
Aavid’s wide selection of standard products provides easy, fast access to cooling solutions for the new generation of LED light sources from Lumileds™.

Liquid Cooled Cold Plates
For high heat concentrations, HiContact™ assemblies offer a cost effective method of cooling.
                                             Tube Cold Plates